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OSU Nanotech West »  Installation of ICP-RIE progressing

News

Wednesday, 03 June 2009

The refurbished Plasma-Therm SLR-770 inductively-coupled plasma reactive ion etch tool in Bay 4 is nearer to readiness. Etch gases (Cl2, CF4, Ar, O2, CHF3, He) have been plumbed to the tool; BCl3 will be added in the next two months. We expect that the tool will have electrical power shortly.

RJD