Get Ready! – Heidelberg Maskless Aligner Installation Nearly Finished

Nanotech West (NTW) staff has been hard at work over the last few weeks to finish the installation and qualification of our new maskless alignment system, the Heidelberg MLA150 . The initial qualification tests have looked very promising and the system is a dream to use even for very small samples. The final installation steps and acceptance testing are currently …

Nanotech West Lab hosted the first annual NTW Thanksgiving Potluck

On Friday, November 22nd Nanotech West Lab hosted the first annual NTW Thanksgiving Potluck. A continuation of the “Ask me Anything” series that started in the September, the event was a hit! Nearly 40 users and staff enjoyed an afternoon full of good company and a huge assortment of delicious dishes from all over the world. No one went home …

NTW acquires advanced maskless aligner from Heidelberg Instruments

Nanotech West Lab (NTW) is pleased to announce the acquisition of an advanced maskless aligner (MLA150) from Heidelberg Instruments. In contrast to a traditional mask aligner, the MLA150 directly exposes electronic patterns onto the sample quickly with no contact and without the need to produce a physical mask. This system is capable of patterning features as small as 0.6 µm …

NTW hosts first “Ask Me Anything” luncheon for users

On Wednesday, August 9th, Nanotech West Lab hosted their first “Ask Me Anything” (AMA) for lab users with more than 40 users attending. The AMA is a wonderful way to share tips and ideas, meet the staff and fellow researchers, and – of course – ask the staff anything. These informal “office hours” allow users to come and go as …

Sparking kids’ interest in science, engineering

Materials Science and Engineering Professor Vicky Doan-Nguyen has a knack for tapping into kids’ innate curiosity to get them excited about science. She also wants every child – especially girls – to know anyone can be a scientist or engineer. Since joining Ohio State in 2017, Doan-Nguyen has spearheaded two outreach programs that are successfully engaging central Ohio kids in …

NTW hosts 3rd annual MAEBL workshop at The Ohio State University

Aimee Price, IMR Senior Research Scientist at Nanotech West Lab (NTW), along with fellow steering committee members Kevin Lister and Gerald Lopez, hosted the 3rd annual, one-day Meeting for Advanced Electron Beam Lithography (MAEBL) at The Ohio State University on Wednesday, April 3rd. This years meeting was supported by OSU’s IMR and by charter sponsors: JEOL USA, Raith Nanofabrication, STS-Elionix, …

Gallium oxide-capable MOCVD system now qualified and operational

Nanotech West is pleased to announce the new gallium oxide-capable metal-organic chemical vapor deposition (MOCVD) system is now qualified and operational. This MOCVD (tool code CVD04) system was manufactured by Agnitron Technology of Minnesota and is specially designed for GaO and AlGaO epitaxy. CVD04 is capable of depositing on 50mm substrates at temperatures as high as 1050° C. The Institute …

NTW Welcomes New Staff Member – Mr. Keith Ramsey

NTW is pleased to announce the arrival of a new technical staff member. Mr. Keith Ramsey joined NTW this week as a Research Associate. You will see Keith spending most of his time in the NTW Cleanroom and the MOCVD Lab where he will serve as the Lab Supervisor in addition to providing tool and process support. As you see …

Database Scheduled Maintenance

Nanotech West Lab (NTW) will be performing scheduled maintenance on the database on Thursday, August 2nd.  The database will be down for approximately 24 hours. Services impacted include the website, scheduling system, interlocks, lab logins, and the displays. Please see the Listserve email for more details.

NTW Enhances Device Packaging Capability with Installation of Ball Bonder

Nanotech West is pleased to announce that a new ball bonder (tool code BND05) is now available for use. The system, a WestBond 7700-E-79 Ball-Wedge Bonder, is located in the Metrology Lab, Room 119. Although the system has both wedge and ball bonding capability, the bonder will be primarily configured to perform ball bonding and compliments the wedge bonding capability …