Nanotech West Labs has recently expanded its device packaging capabilities with the installation of a SET FC150 (tool code BND04) “flip chip” bonder. Designed to enable precision aligned chip or die bonding, the machine is configured with a low-contact force (up to 4N) solder reflow arm (SRA) with 2″ chucks as well as a laser leveling system. A split field microscope and precision XY-stage enable placement accuracy of ~1µm while separate upper and lower IR heaters allow components to be heated up to 450° C. The FC150 completed qualification on 8/18/17 and is installed in Bay 4 of the cleanroom.
For more information or to schedule training contact Dave Hollingshead (hollingshead.19@osu.edu) or another NTW staff member.
