NTW Enhances Device Packaging Capability with Installation of Ball Bonder

Nanotech West is pleased to announce that a new ball bonder (tool code BND05) is now available for use. The system, a WestBond 7700-E-79 Ball-Wedge Bonder, is located in the Metrology Lab, Room 119. Although the system has both wedge and ball bonding capability, the bonder will be primarily configured to perform ball bonding and compliments the wedge bonding capability already provided by BND02 (Kulicke and Soffe 4123). A user-friendly, manual bonding system, the bonder has been tested with initial processes using both aluminum and gold wire and is now available for training.

For more information or to schedule training contact NTW Lab Coordinator Pete Janney (Janney.9@osu.edu) or another NTW staff member.