Nanotech West is pleased to announce that a new thermal evaporator (tool code EVP05) is now available for use in the NTW Cleanroom. The system, located in the labs core space next to Bay 4, is a Denton 502A thermal evaporator (the same layout and chamber design as EVP01) and has a carousel sized to deposit on three 100mm wafers per run. While the system will be open to the deposition of various materials it will primarily be dedicated to the deposition of thick Indium layers (multiple microns) like those required for the formation of Indium bumps prior to flip-chip bonding. An initial thick Indium deposition and liftoff process (nominally 2.5 µm) has already been demonstrated and additional processes will be developed and further characterized in the coming month.
For more information or to schedule training contact NTW Research Associate Jay Delombard (delombard.1@osu.edu) or another NTW staff member.
