Earlier this year NTW acquired and installed a PlasmaTherm 770 ICP-RIE system (tool code ETC05) through collaboration with the AFRL Sensors Directorate at Wright Patterson AFB. Thanks in part to support from the Ohio Sensor and Semiconductor Innovation Platform (OSSIP) program, funded by Ohio Third Frontier and the Ohio Development Services Agency, that system has now been upgraded to provide more robust and reliable processes for deep Si etching. With a limited set of process gases available (SF6, C4F8, O2 and Ar) this ICP-RIE system will be primarily dedicated to the etching of Si materials. While specific processes will be developed and further characterized in the coming month, ETC05 is now available for use.
For additional information contact NTW Lab Services Coordinator Derek Ditmer (ditmer.2@osu.edu)or another NTW staff member.
