Nanotech West Labs has recently expanded its device packaging capabilities with the installation of a SET FC150 (tool code BND04) “flip chip” bonder. Designed to enable precision aligned chip or die bonding, the machine is configured with a low-contact force (up to 4N) solder reflow arm (SRA) with 2″ chucks as well as a laser leveling system. A split field …
New Lapping and Polishing Capabilities at Nanotech West
Nanotech West now offers the capability to thin samples down and polish samples smooth using the new PM4 lapper and PM5 polisher. The last polishing step offers a contamination-free colloidal silica environment for nanometer-scale final roughness. These processes would be excellent for preparing samples for bonding, eliminating damage after ion implantation, damascene-style metal patterning, optical surface preparations, creating thin layers …
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