Engineering Intern Jayne Griffith with the new Plasma-Therm Takachi ICP-RIE
NTW’s newest dry etch system has arrived.
The Plasma-Therm Takachi ICP-RIE is a compact and robust dry etch platform suitable for etching a wide range of semiconductor materials. It greatly extends Nanotech West’s etch capabilities with additional gas options, sample temperature control between -20 to +250C, and a laser-based endpoint detection system for monitoring the etch process in real time. The new system will be installed in conjunction with our current Plasma-Therm 770 ICP-RIE (ETC04). The Takachi system will use the same software interface as the recently upgraded ETC04 for straightforward process transition between the systems.
Work has already begun to connect to building facilities. When that is completed, the next steps will be manufacturer installation and process qualification. NTW plans to have the tool operational by early November.