NameNotesStatusUpdated
RTA01-AGA 410 Rapid Thermal AnnealerGlass slide that supports TC leads is broken but repositioned leads so they contact bottom of carrrier wafer. Not stable so be cautious.Now Up7/11/2018
ASH01-Diener Pico Oxygen Plasma AsherWas not reaching power setpoint. Had to run O2 plasma for an hour.Now Up7/2/2018
PRB05-Electro-Optical Test PlaformIsolated use by NiSource project through JulyDown6/18/2018
EDS02-Oxford EDS SDD (SEM02)Detector is now aligned. Still needs to be cooled down before starting. Contact A. Price before using.Now Up5/21/2018

Current Tool Configurations

NameNotesUpdated
ETC01-Technics Benchtop RIECh A: O2
Ch B: CF4
7/17/2018
PVD03-AJA Orion RF/DC Sputter Deposition Tool
Requested Targets

1 DC
2 RF
3 DC
4 RF
5 RF
Current
Ag
Ti
Ni
ITO
Al
07/19/18
Available
Available
Available
Available
Available
07/23/18
Available
Available
Available
Available
Available
07/26/18
Available
Available
Available
Available
Available
07/30/18
Available
Available
Available
Available
Available
Available Targets:
Ag, Al, Al2O3 , Co, Cr, Cu, Fe, ITO, Mo, MgO, Nb, Nb2O5, Ni, NiCr (80/20%), NiFe, SiO2, Ti, V, W, W/Ti (10/90%)

*User Supplied
7/16/2018
ALD01-Picosun SUNALE R-150B Atomic Layer Deposition Tool
Requested Sources

A
B
C
D
Current
TMGa*
TaCl5
H2O
O3
7/5/18
TMGa*
Available
H2O
O3
7/12/18
TMGa*
Available
H2O
O3
7/19/18
TMA
Available
H2O
O3
Available Precursors: Source A: TMA, Diethyl Zinc, TiCl4, Triethyl Gallium, Source B: TaCl5, HfCMMM
7/5/2018
BND03-K&S 4123 Wedge Wire BonderCurrent: Al
Requested: Available

Available Wire: Au, Al
6/26/2018
EVP05-Denton 502A Thermal EvaporatorIndium only, contact for other materials to be approved. 4/27/2018
EVP03-CHA Solution System E-Gun EvaporatorMaterials available: Ag, Al, Au, Cr, Ge, Mo, Ni, NiCr, Pd, Pt, Si, Ti, V 10/31/2017
SAW01-K&S 7100 Precision Dicing Saw
Ability to Dice

Wafer Dia
Max Wafer Thickness
Blade Thickness
Silicon
6in
1.0mm
45um
Sapphire
6in
900um
220um
Glass/Quartz
6in
1.0mm
200um
Fused Silica
6in
1.2mm
200um
SiC
6in
500um
30um
GaN and InP
6in
700um
30um
Ability to Dice: silicon, sapphire, glass, quartz, fused silica, SiC, GaN and InP. For non common substrate, user will purchase blade. Contact for Blade Vendor info.
6/27/2016
ALN02-EV Group 620 Advanced Contact AlignerL - 5x objective
R - 5x objective
1/13/2014