NameNotesStatusUpdated
CVD02-Plasma Therm 790 PECVDWill be down Thurs. Hopefully back up on Friday.Down2/14/2018
EDS02-Oxford EDS SDD (SEM02)large noise peak at very low energy 0.1keV. Will affect low energy resolution.Partially Operational10/24/2017

Current Tool Configurations

NameNotesUpdated
PVD03-AJA Orion RF/DC Sputter Deposition Tool
Requested Targets

1 DC
2 RF
3 DC
4 RF
5 RF
Current
V*
Ti
Cu
Si*
Ag
02/22/18
Available
Available
Available
Available
Available
02/26/18
Available
Available
Available
Available
Available
03/02/18
Available
Available
Available
Available
Available
03/05/18
Available
Available
Available
Available
Available
Available Targets:
Ag, Al, Al2O3 , Co, Cr, Cu, Fe, ITO, Mo, MgO, Nb, Nb2O5, Ni, NiCr (80/20%), NiFe, SiO2, Ti, V, W, W/Ti (10/90%)

*User Supplied
2/19/2018
ALD01-Picosun SUNALE R-150B Atomic Layer Deposition Tool
Requested Sources

A
B
C
D
Current
TMA
TaCl5
H2O
n/a
2/22/18
Triethyl Gallium*
Available
H2O
n/a
3/1/18
Diethyl Zinc
Available
H2O
n/a
3/8/18
Available
Available
H2O
n/a
Available Precursors:
Source A: TMA, Diethyl Zinc, TiCl4
Source B: TaCl5, HfCMMM

*User Supplied
2/16/2018
EVP03-CHA Solution System E-Gun EvaporatorMaterials available: Ag, Al, Au, Cr, Ge, Mo, Ni, NiCr, Pd, Pt, Si, Ti, V 10/31/2017
ETC01-Technics Benchtop RIECh A: O2
Ch B: CF4
7/12/2017
SAW01-K&S 7100 Precision Dicing Saw
Ability to Dice

Wafer Dia
Max Wafer Thickness
Blade Thickness
Silicon
6in
1.0mm
45um
Sapphire
6in
900um
220um
Glass/Quartz
6in
1.0mm
200um
Fused Silica
6in
1.2mm
200um
SiC
6in
500um
30um
GaN and InP
6in
700um
30um
Ability to Dice: silicon, sapphire, glass, quartz, fused silica, SiC, GaN and InP. For non common substrate, user will purchase blade. Contact for Blade Vendor info.
6/27/2016
ALN02-EV Group 620 Advanced Contact AlignerL - 5x objective
R - 5x objective
1/13/2014
EVP04-Cooke Thermal EvaporatorIndium and aluminum only 2/22/2018