NameNotesStatusUpdated
SEM02-Zeiss Ultra 55 Plus FE-SEMBroken spring has been removed. Please send an immediate note of any odd stage travel issues.Partially Operational10/13/2017
SAT01-Semitool Hydro3 Wafer Cleaning ToolTesting different power supply for computer to fix reboot loop problem.Early results promising.Down10/13/2017
EDS02-Oxford EDS SDD (SEM02)Contact staff to get re-trainedPartially Operational9/25/2017

Current Tool Configurations

NameNotesUpdated
ALD01-Picosun SUNALE R-150B Atomic Layer Deposition Tool
Requested Sources

A
B
C
D
Current
TMA
TaCl5
H2O
NH3
10/19/17
TMA
TaCl5
H2O
NH3
10/26/17
Available
Available
H2O
NH3
11/2/17
Available
Available
H2O
NH3
Available Precursors: Source A: TMA, Diethyl Zinc, TiCl4, Source B: TaCl5, HfCMMM
10/19/2017
PVD03-AJA Orion RF/DC Sputter Deposition Tool
Requested Targets

1 DC
2 RF
3 DC
4 RF
5 RF
Current
V*
Ti
Cu
SiO2
Al
10/23/17
Available
Available
Available
SiO2
Available
10/26/17
Available
Available
Available
SiO2
Available
10/30/17
Available
Available
Available
Available
Available
11/02/17
Available
Available
Available
Available
Available
Available Targets:
Ag, Al, Al2O3 , Co, Cr, Cu, Fe, ITO, Mo, MgO, Nb, Nb2O5, Ni, NiCr (80/20%), NiFe, SiO2, Ti, V, W, W/Ti (10/90%)

*User Supplied
10/19/2017
ETC01-Technics Benchtop RIECh A: O2
Ch B: CF4
7/12/2017
SAW01-K&S 7100 Precision Dicing Saw
Ability to Dice

Wafer Dia
Max Wafer Thickness
Blade Thickness
Silicon
6in
1.0mm
45um
Sapphire
6in
900um
220um
Glass/Quartz
6in
1.0mm
200um
Fused Silica
6in
1.2mm
200um
SiC
6in
500um
30um
GaN and InP
6in
700um
30um
Ability to Dice: silicon, sapphire, glass, quartz, fused silica, SiC, GaN and InP. For non common substrate, user will purchase blade. Contact for Blade Vendor info.
6/27/2016
EVP03-CHA Solution System E-Gun EvaporatorMaterials available: Ag, Al, Au, Cr, Ge, Ni, NiCr, Pd, Pt, Ti, Mo, V 6/23/2016
ALN02-EV Group 620 Advanced Contact AlignerL - 5x objective
R - 5x objective
1/13/2014
EVP04-Cooke Thermal EvaporatorIndium and aluminum only 10/21/2017