BND04 inside
Nanotech West Labs has recently expanded its device packaging capabilities with the installation of a SET FC150 (tool code BND04) "flip chip" bonder. Designed to enable precision aligned chip or die bonding, the machine is configured with a low-contact force (up to 4N) solder reflow arm (SRA) with 2" chucks as well as a laser leveling system. A split field microscope and precision XY-stage enable placement accuracy of ~1µm while separate upper and lower IR heaters allow components to be heated up to 450° C. The FC150 completed qualification on 8/18/17 and is installed in Bay 4 of the cleanroom.

For more information or to schedule training contact Dave Hollingshead (This email address is being protected from spambots. You need JavaScript enabled to view it.) or another NTW staff member.