Nanotech West now offers the capability to thin samples down and polish samples smooth using the new PM4 lapper and PM5 polisher. The last polishing step offers a contamination-free colloidal silica environment for nanometer-scale final roughness. These processes would be excellent for preparing samples for bonding, eliminating damage after ion implantation, damascene-style metal patterning, optical surface preparations, creating thin layers of sample material, and reclamation of valuable substrates for rework. Wafers of 100mm or 75mm diameter can be polished directly, while smaller samples can be bonded to carriers for processing.

Contact Jay DeLombard at This email address is being protected from spambots. You need JavaScript enabled to view it. for more information.