Other significant process capabilities at Nanotech West include:

  • Wafer bonding using our EV520HE wafer bonder/hot embossing tool
  • Wedge wire bonding using a Kulicke and Soffe 4123 wire bonder - 1.0 mil Au and 1.0 mil Al wire and the corresponding wedges are available
  • Manual wafer and sample grinding processes
  • An MBraun nitrogen-purged glovebox for handling and processing air-sensitive materials