Nanotech West has extensive capabilities in dry and wet etching. They include:

  • Inductively coupled reactive ion etching (ICP-RIE) using a Plasma Therm SLR770 tool (ETC04)
  • Plasma etching with a Lam 490 Autoetch (ETC02)
  • Reactive ion etching with a Technics Micro-RIE tool (ETC01)
  • Low-damage oxygen plasma ashing using a Diener Pico asher (ASH01)
  • Wet etching supported by three cleanroom wet benches (HOD07, HOD08, HOD09)
  • Spin rinse dryers for 100mm wafer processing